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CDMIA and CCIBC Signed Cooperation Agreement

2014/02/25 16:33


China Die & Mould Industry Association (CDMIA) Executive Vice President & Secretary General Mr.Wu BingShu and Chamber of Commerce and Industry Brazil-China (CCIBC) President Mr. Charles Tang signed a joint cooperation agreement in Beijing on Feb 20, 2014. Both sides agreed to hold Brazil-China Die & Molding Industry Technology and Trade Conference in Joinville, Brazil in August, 2014. Vice Secretary General Ms. Li YuHua of CDMIA, Vice President Mr. Ryan Huang of Shenzhen Silver Basis Technology Co., Ltd., and representatives from a Brazilian mold company attended the signing ceremony.

In order to enhance the cooperation between China and Brazil die and mold industry, CDMIA and CCIBC reached cooperation agreement in many sectors: information exchange, promoting mutual trade, personnel training, introducing talents, providing consultation and assistance, mutual supporting exhibitions and activities, and providing necessary service and support to delegations of each side.

Meanwhile, in order to promote technology exchange and trade development of the die and mold industry, CDMIA and CCIBC decided to jointly organize Brazil-China Die & Molding Industry Technology and Trade Conference on August 18-19, 2014 in Joinville, Brazil. CCIBC will invite buyers from members of related Brazilian automobile (and auto parts) associations, Brazilian electronics (and home appliances) associations and other relevant industry associations. This conference aims to build a great trading platform for die and mold industry between China and Brazil.

We believe the cooperation between CDMIA and CCIBC will  enhance mutual understanding and strengthen economic cooperation between China and Brazil die and mold industry.


 
 
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